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DG-10Y029D
3-3. Derating curve
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Forward Current Derating Curve
Model No.
GW5D*C**M04
Page
5 of 18
-30 -20 -10
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Case Temperature T c [ ℃ ]
(Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to
be secured by using an adequate heat sink.
For soldering connection, please evaluate in your circumstance to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation not to exceed case temperature over the rating
in operation.
（ Measuring point for case temperature ）
measuring point
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